ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,774, issued on Nov. 3, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Katsuhiko Yoshihara (Kyoto, Japa... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,775, issued on Nov. 3. "Semiconductor package structure having thermal management structure" was invented by Chun-Ming Lin (Hsinchu County, ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,776, issued on Nov. 3, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Sensor device with improved heat dissipation" ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,777, issued on Nov. 3, was assigned to HITACHI ENERGY LTD (Zurich). "Flow inverter and power semiconductor component" was invented by Lluis ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,778, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods, systems, apparatus, and articles of manufacture to cool ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,779, issued on Nov. 3, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Memories and fabrication methods thereof, memor... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,780, issued on Nov. 3, was assigned to INVENTEC (PUDONG) TECHNOLOGY Corp. (Shanghai) and INVENTEC Corp. (Taipei City, Taiwan). "Heat dissipa... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,781, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Cheol K... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,782, issued on Nov. 3, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device" was invented by Yoichi Sasaki (Kariya-city, ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,783, issued on Nov. 3, was assigned to X-Celeprint Ltd. (Dublin). "Micro-transfer-printable component modules with a module tether and micro... Read More